Adaptive scalable wireless charging module with free positioning

ABSTRACT

A wireless charging resource includes: processing elements; insulating elements; and coils, where the processing elements, insulating elements, and coils are arranged in a repeating array. A method of wireless charging includes: sending, from a charging resource, an analog ping to identify charging coils associated with a charging receiver; sending a digital ping to identify optimal charging coils; and activating the optimal charging coils in order to provide charging power to the charging receiver. A method of generating a layout for a wireless charging transmitter includes: determining an available area; calculating a number of coils to be included in an array; arranging a first set of coils including the number of coils on a first coil layer; arranging a second set of coils including the number of coils on a second coil layer; and arranging a third set of coils including the number of coils on a third coil layer.

BACKGROUND

Many devices, such as smartphones, tablets, wearable devices, etc.utilize wireless (or “inductive”) charging, where a charging pad orsimilar device supplies charging energy to a user device withoutrequiring any wired connections.

Existing solutions require exact positioning and orientation of a devicein order to ensure that charging is activated and/or efficient.

In addition, existing solutions require dedicated chargers for differentdevices due to varying power handling capabilities of the devices beingcharged.

Furthermore, existing solutions consume extensive time in generating acharger-specific layout for a charging transmitter.

Therefore there exists a need for a scalable wireless charging solutionthat allows free positioning and is able to supply various devices withvarious power handling capabilities.

SUMMARY

Some embodiments may provide a wireless charging resource. The wirelesscharging resource may include a transmitter that is able to transferpower to a user device having a charging receiver.

The transmitter may include multiple modules distributed across multiplelayers.

Such modules may include a processing module, an insulating module, anda coils module. The coils module may include multiple layers of coils.

The transmitter may include an array of interlocking sections, whereeach section includes the various modules described above. Such sectionsmay be coupled together to generate larger transmitter areas. In thisway, a section layout may be reused to scale to any size transmitterarea.

The charging resource may utilize multiple coil sets in order to providefree positioning of the user device. Such coil sets may include coilsacross multiple layers (e.g., bottom, middle, and top). The chargingresource may evaluate multiple coil sets and, based on feedback from theuser device, select one or more optimal coil sets.

Some embodiments may adjust charging parameters based on feedback fromthe user device. Such parameters may include, for instance, voltage,frequency, duty cycle, and/or phase shift. Such adjustments may include,for instance, varying charging power from a low starting value until amaximum charging power for a particular device is identified. In thisway, devices with varying charging capabilities may all be efficientlycharged without damage.

The preceding Summary is intended to serve as a brief introduction tovarious features of some exemplary embodiments. Other embodiments may beimplemented in other specific forms without departing from the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The exemplary features of the disclosure are set forth in the appendedclaims.

However, for purpose of explanation, several embodiments are illustratedin the following drawings.

FIG. 1 illustrates a schematic block diagram of wireless charging systemaccording to an exemplary embodiment;

FIG. 2 illustrates a schematic block diagram of a transmitter includedin the system of FIG. 1;

FIG. 3 illustrates a top plan view of a processing layer included in thetransmitter of FIG. 2;

FIG. 4 illustrates a top plan view of an insulating layer included inthe transmitter of FIG. 2;

FIG. 5 illustrates a top plan view of a first layer of coils included inthe transmitter of FIG. 2;

FIG. 6 illustrates a top plan view of a second layer of coils includedin the transmitter of FIG. 2;

FIG. 7 illustrates a top plan view of a third layer of coils included inthe transmitter of FIG. 2;

FIG. 8 illustrates a top plan view of the first, second, and thirdlayers of coils included in the transmitter of FIG. 2;

FIG. 9 illustrates a top plan view of the processing layer, insulatinglayer, and first, second, and third layers of coils included in thetransmitter of FIG. 2;

FIG. 10 illustrates a top plan view of a multiple tile arrangement ofprocessing layers included in the transmitter of FIG. 2;

FIG. 11 illustrates a top plan view of the multiple tile arrangement ofFIG. 10, as assembled;

FIG. 12 illustrates a top plan view of a multiple tile arrangement ofinsulating layers included in the transmitter of FIG. 2;

FIG. 13 illustrates a top plan view of the multiple tile arrangement ofFIG. 12, as assembled;

FIG. 14 illustrates a top plan view of a multiple tile arrangement ofcoil layers included in the transmitter of FIG. 2;

FIG. 15 illustrates a top plan view of the multiple tile arrangement ofFIG. 14, as assembled;

FIG. 16 illustrates a top plan view of a multiple tile arrangement ofall layers included in the transmitter of FIG. 2;

FIG. 17 illustrates a top plan view of the multiple tile arrangement ofFIG. 16, as assembled;

FIG. 18 illustrates a top plan view of an example transmitter area;

FIG. 19 illustrates a top plan view of a set of coils included in thetransmitter area of FIG. 18;

FIG. 20 illustrates a top plan view of coils included in the first,second, and third coil layers of some embodiments;

FIG. 21 illustrates a top plan view of a hexagonal layout used for theinsulating layer in some embodiments;

FIG. 22 illustrates a top plan view of a rectangular layout used for theprocessing layer in some embodiments;

FIG. 23 illustrates a flow chart of an exemplary process that generatesa transmitter layout based on an available area;

FIG. 24 illustrates a flow chart of an exemplary process that charges auser device;

FIG. 25 illustrates a flow chart of an exemplary process that performs adigital ping to identify optimal charging coils;

FIG. 26 illustrates a flow chart of an exemplary process that adjustsdevice charging parameters based on user device feedback; and

FIG. 27 illustrates a schematic block diagram of an exemplary computersystem used to implement some embodiments.

DETAILED DESCRIPTION

The following detailed description describes currently contemplatedmodes of carrying out exemplary embodiments. The description is not tobe taken in a limiting sense, but is made merely for the purpose ofillustrating the general principles of some embodiments, as the scope ofthe disclosure is best defined by the appended claims.

Various features are described below that can each be used independentlyof one another or in combination with other features. Broadly, someembodiments generally provide an adaptive scalable wireless chargingresource with free positioning.

A first exemplary embodiment provides a wireless charging resourcecomprising: a plurality of processing elements; a plurality ofinsulating elements; and a plurality of coils, wherein the processingelements, insulating elements, and coils are arranged in a repeatingarray.

A second exemplary embodiment provides a method of performing wirelesscharging, the method comprising: sending, from a charging resource, ananalog ping to identify a list of charging coils associated with acharging receiver; sending, from the charging resource, a digital pingto identify a set of optimal charging coils; and activating the set ofoptimal charging coils in order to provide charging power to thecharging receiver.

A third exemplary embodiment provides a method of generating a layoutfor a wireless charging transmitter, the method comprising: determiningan available transmitter area; calculating a number of coils to beincluded in an array; arranging a first set of coils including thenumber of coils on a first coil layer; arranging a second set of coilsincluding the number of coils on a second coil layer; and arranging athird set of coils including the number of coils on a third coil layer.

Several more detailed embodiments are described in the sections below.Section I provides a description of an exemplary system architecture ofsome embodiments. Section II then describes an exemplary transmitterarchitecture of some embodiments. Next, Section III describes methods ofoperation used by some embodiments. Lastly, Section IV describes acomputer system which implements some of the embodiments.

I. System Architecture

FIG. 1 illustrates a schematic block diagram of wireless charging system100 according to an exemplary embodiment. As shown, the system mayinclude a user device 110 and a charging resource 120 of someembodiments.

The user device 110 may include a wireless charging receiver 140. Theuser device 110 may be a device such as a smartphone, tablet, personalcomputer, wearable device, etc. The receiver 140 may include coils orsimilar structures that are able to convert wireless signals intocharging power.

The charging resource 120 may include a wireless charging transmitter130. The charging resource 120 may be an electronic device provided invarious appropriate form factors (e.g., charging pad, charging station,multi-use power dock, etc.). One example transmitter 130 will bedescribed in reference to FIG. 2 below.

The elements of system 100 may operate using the Qi open interfacestandard and/or other appropriate protocols, standards, etc.

FIG. 2 illustrates a schematic block diagram of a transmitter 200included in the system 100. The exemplary transmitter 200 is one exampleof a transmitter that may serve as transmitter 130. As shown,transmitter 200 may include a processing module 210, an insulatingmodule 220, and a coils module 230.

The processing module 210 may include coil drivers and variouscontrollers (e.g., micro controllers). In some embodiments, theprocessing module may be implemented using multiple-layers of printedcircuit boards (PCBs) in order to match the size of other associatedelements (e.g., the coils module). The processing module may includemultiple processing elements that are arranged in a repeating array.

The insulating module 220 may shield the processing module 210 from themagnetic fields generated by the coils module 230. The insulating modulemay include ferrite and/or other appropriate materials. The insulatingmodule may include multiple insulating elements that are arranged in arepeating array.

The coils module 230 may include multiple layers of coils in anarrangement that provides full charging coverage of the entire chargingarea. The coils module may include multiple coils across the multiplelayers that are arranged in a repeating array.

Exemplary layouts are described in Section II below.

One of ordinary skill in the art will recognize that the chargingresource 120 and transmitter 130 or 200 may be implemented in variousdifferent ways without departing from the scope of the disclosure. Forinstance, the charging resource may include multiple transmitters. Asanother example, the transmitter may include additional modules and/oromit various modules. Different embodiments may be arranged in differentways. The size and/or shape of the elements may vary in different ways.

II. Physical Architecture

FIG. 3 illustrates a top plan view of a section of a processing layer300 included in the transmitter 200. The processing layer 300 mayinclude components described above in reference to the processing module210.

The processing layer 300 may be laid out such that the other transmitterelements are able to be aligned to the processing layer. In thisexample, the processing layer includes repeating sections 310. Differentembodiments may include differently sized and/or shaped sections. Insome embodiments, the processing layer 300 may include multiple PCBlayers. The processing layer may include various connection points orwires (not shown).

FIG. 4 illustrates a top plan view of a section of an insulating layer400 included in the transmitter 200. The insulating layer 400 mayinclude components described above in reference to the insulating module220. The insulating layer may include ferrite and/or other appropriatematerials that are able to block and/or absorb electromagnetic energy.

The insulating layer 400 may be laid out such that the other transmitterelements are able to be aligned to the insulating layer. In thisexample, the insulating layer 400 includes repeating sections 410. Theinsulating layer may include various connection points or wires (notshown).

FIG. 5 illustrates a top plan view of a section of a first layer (or“bottom” layer) of coils 500 included in the transmitter 200. The firstlayer of coils 500 may include components described above in referenceto the coils module 230. The first layer of coils 500 may include metaland/or other appropriate materials that are arranged such that anoscillating supply is able to be converted into an electromagneticfield.

The first layer of coils 500 may be laid out such that the othertransmitter elements are able to be aligned to the first layer of coils.In this example, the first layer of coils 500 includes repeatingsections 510. The first layer of coils may include various connectionpoints or wires (not shown).

FIG. 6 illustrates a top plan view of a section of a second layer (or“middle” layer) of coils 600 included in the transmitter 200. The secondlayer of coils 600 may include components described above in referenceto the coils module 230. The second layer of coils may include metaland/or other appropriate materials that are arranged such that anoscillating supply is able to be converted into an electromagneticfield.

The second layer of coils 600 may be laid out such that the othertransmitter elements are able to be aligned to the second layer ofcoils. In this example, the second layer of coils 600 includes repeatingsections 610. The second layer of coils may include various connectionpoints or wires (not shown).

FIG. 7 illustrates a top plan view of a section of a third layer (or“top” layer) of coils 700 included in the transmitter 200. The thirdlayer of coils 700 may include components described above in referenceto the coils module 230. The third layer of coils may include metaland/or other appropriate materials that are arranged such that anoscillating supply is able to be converted into an electromagneticfield.

The third layer of coils 700 may be laid out such that the othertransmitter elements are able to be aligned to the third layer of coils.In this example, the third layer of coils 700 includes repeatingsections 710. The third layer of coils may include various connectionpoints or wires (not shown).

FIG. 8 illustrates a top plan view of a section 800 of the first 500,second 600, and third 700 layers of coils included in the transmitter200. As shown, the various layers form a partially overlapping pattern.In this example, the array (or “lattice”) of coils 600 may be the sameshape as array 700, offset by somewhat more than a radius of each coilalong the x-axis. The three arrays 500, 600, and 700 may be arrangedsuch that the top on bottom of each array is aligned along the y-axis.

FIG. 9 illustrates a top plan view of a section 900 of the processinglayer 300, insulating layer 400, and first 500, second 600, and third700 layers of coils included in the transmitter 200. As above, thevarious layers are aligned to form an overlapping pattern. In thisexample, the scalable section 900 is four by two (or two by one), inthat each layer includes four coils along the x-axis 910 and two coilsalong the y-axis 920.

FIG. 10 illustrates a top plan view of a multiple tile arrangement 1000of processing layer sections 300 included in the transmitter 200. FIG.11 illustrates a top plan view of the multiple tile arrangement 1100, asassembled. As shown, the sections 300 may fit together to cover largerareas. The sections are shaped such that the sections may be repeated inany direction to generate a repeating array that is able to cover anysize area (larger than the section itself). Although the differentsections have different fill patterns for clarity, the sections would beidentical in an actual implementation.

FIG. 12 illustrates a top plan view of a multiple tile arrangement 1200of insulating layer sections 400 included in the transmitter 200. FIG.13 illustrates a top plan view of the multiple tile arrangement 1300, asassembled. As shown, the sections 400 may fit together to cover largerareas. The sections are shaped such that the sections may be repeated inany direction to cover any size area (larger than the section itself).Although the different sections have different fill patterns forclarity, the sections would be identical in an actual implementation.

FIG. 14 illustrates a top plan view of a multiple tile arrangement 1400of coil layer sections 800 included in the transmitter 200. FIG. 15illustrates a top plan view of the multiple tile arrangement 1500, asassembled. As shown, the sections 800 may fit together to cover largerareas. The sections are shaped such that the sections may be repeated inany direction to cover any size area (larger than the section itself).Although the different sections have different fill patterns forclarity, the sections would be identical in an actual implementation.

The various layer sections 500, 600, and 700 may be complementary inshape, layout, size, etc., such that combined sections of layers 800 mayfit together to cover larger areas. The sections are shaped such thatthe sections may be repeated in any direction to cover any size area(larger than the section itself).

FIG. 16 illustrates a top plan view of a multiple tile arrangement 1600of all layer sections 900 included in the transmitter 200. FIG. 17illustrates a top plan view of the multiple tile arrangement 1700, asassembled. As shown, the sections 900 may fit together to cover largerareas. The sections are shaped such that the sections may be repeated,or “snapped” together, in any direction to cover any size area (largerthan the section itself). The different sections may also includevarious connectors (not shown) that are able to electrically connect thevarious sections to various resources (e.g. adjacent or non-adjacentsections, various supplies or control lines, etc.). Although thedifferent sections have different fill patterns for clarity, thesections would be identical in an actual implementation.

The various layer sections 300, 400, and 800 may be complementary inshape, layout, size, etc., such that combined sections of layers 900 mayfit together to cover larger areas. The sections are shaped such thatthe sections may be repeated in any direction to cover any size area(larger than the section itself).

In this example, each section 900 may have a two by one footprint.Different embodiments may include different sections having differentspecific footprints, as described below in reference to FIG. 18-FIG. 23.

FIG. 18 illustrates a top plan view of an example transmitter area 1800.As shown, this area is defined as having a four unit 1810 x-dimensionand a two unit y-dimension. Different areas may have irregulardimensions (i.e., non-integer ratios). Such non-integer portions may beignored or otherwise managed. In addition, the ratios may be differentthan shown or described. As described in more detail in Section IIIbelow, any size or shape area may be utilized.

FIG. 19 illustrates a top plan view of a set of coils 1910 included inthe transmitter area 1800. One sub-section of coils has been highlightedwith a different fill color. The sub-section in this example is the sameas coil layer section 500 described above. Sections 300, 400, and 800may be defined as two by one sections.

FIG. 20 illustrates a top plan view of coils included in the first 500,second 600, and third 700 coil layers of some embodiments. As shown, thecoils may all be the same size as each other, with a specified radius,with corresponding diameter 2010. As shown, the coils 500, 600, and 700may be round when viewed from above, or cylindrical when viewed from athree dimensional perspective. Of course, different embodiments mayinclude differently sized and/or shaped coils.

FIG. 21 illustrates a top plan view of a hexagonal layout 410 used forthe insulating layer 400 in some embodiments. As shown, the hexagon 410may include six identically sized triangles 2110. The distance betweenopposite sides of the hexagon 410 may be the same (or slightly largerthan) the diameter 2010, such that any coil 500, 600, or 700 may be ableto fit within the hexagon 410 when viewed from the top, as shown.

FIG. 22 illustrates a top plan view of a rectangular layout 310 used forthe processing layer 300 in some embodiments. As shown, the layout maybe square and may have a side length 2210 that is equal to a base lengthof triangle 2110.

One of ordinary skill in the art will recognize that the various layersand modules described above may be implemented in various different wayswithout departing from the scope of the disclosure. For instance,different embodiments may have different specific layouts, additionallayers (including additional coil layers, insulating layers, processinglayers, and/or other appropriate layers), etc. The various layers mayhave various appropriate thicknesses depending on various appropriatefactors (e.g., charging power, material composition, area, etc.).Furthermore, additional elements, components, and/or materials may beincluded. For instance, there may be various insulating materials usedto space layers, fill gaps between components, etc.

III. Methods of Operation

FIG. 23 illustrates a flow chart of an exemplary process 2300 thatgenerates a transmitter layout based on an available area. The processmay be executed by a computing device such as a personal computer orworkstation. Such a process may begin, for instance, when a userlaunches a layout application of some embodiments.

As shown, the process may determine (at 2310) available area for atransmitter. The “area” refers to a two-dimensional area when viewedfrom above. The transmitters may have various appropriate depthsallowing for components of various thicknesses. Such a determination maybe made in various appropriate ways. For instance, the area may beretrieved from a layout application or data storage resource associatedwith a charging device. As another example, the area dimensions may bereceived from an administrator or designer.

Next, the process may calculate (at 2320) the number of coils per layerto be included in the transmitter using equation (1) below.NC _(L)=2*x*2*y  (1)

Where NC_(L) is the number of coils per layer, x is the horizontalexpansion factor and y is the vertical expansion factor (x>=1, y>=1).Thus, the total number of coils may be three times NC_(L) for the threelayer arrangement described above.

The process may then arrange (at 2330) the coils on each layer. Sucharrangement may be performed in various appropriate ways. For instance,some embodiments may calculate a coil size based on the available area(which may be adjusted to account for various margins, offsets, etc.)and the number of coils per layer. The coils may then be arranged usingrepeating patterns as described above in reference to FIG. 14 and FIG.15.

Next, process 2300 may lay out (at 2340) the insulating layer based onthe coil arrangement. The process may then lay out (at 2350) theprocessing layer based on the insulating layer and then may end. Theinsulating layer and the processing layer may be aligned to the bottomlayer of coils in some embodiments, as described above in reference toFIG. 9. The layouts of the insulating layer and the processing layer maybe based on the geometric relationships described in reference to FIG.20-FIG. 22.

FIG. 24 illustrates a flow chart of an exemplary process 2400 thatcharges a user device. Such a process may be executed by a chargingresource of some embodiments, such as resource 120. The process maybegin, for instance, when the charging resource is powered on.

As shown, the process may determine (at 2410) whether a charging devicehas been engaged. Such a determination may be made in variousappropriate ways. For instance, a signal may be received from thedevice. As another example, the charging resource may periodically scana charging surface. As another example, the charging resource may simplyperform process 2400 at regular intervals whether a device is sensed ornot.

If the process determines (at 2410) that no device is engaged, theprocess may repeat operation 2410 until the process determines (at 2410)that a device is engaged. If the process determines (at 2410) that adevice is engaged, the process may then determine (at 2420) whether thedevice has a status of “discovered”. Such a determination may be made invarious appropriate ways. For instance, the charging resource may storea list of discovered devices (e.g., identified by MAC address, otherunique identifier, etc.).

If the process determines (at 2420) that the device does not havediscovered status, the process may perform (at 2430) an analog ping. Theanalog ping may be associated with the Qi standard. The analog ping mayidentify a list of transmitting or charging coils (from the chargingresource of some embodiments) that may be associated with a chargingreceiver from a user device to be charged. Such association may bedefined by physical positioning (e.g., if a flat charging pad is used,the list of coils associated with a receiver may include coils with aportion of a receiver above).

Next, the process may determine (at 2440) whether there was a responseto the analog ping. A response message may be generated by the engageduser device in response to the analog ping. Such a response may includethe list of identified coils. If the process determines (at 2440) thatthere was no response, the process may repeat operations 2410-2440 untilthe process determines (at 2440) that a response has been received.

If the process determines (at 2440) that a response has been received,the process may then perform (at 2450) a digital ping. An example ofsuch a ping will be described in more detail in reference to process2500 below.

Process 2400 may then determine (at 2460) whether a response to thedigital ping has been received. A response may be generated by thecharging resource based on the digital ping. Such a response may includea list of optimal coil sets, where each coil set may include a bottomlayer coil, a middle layer coil, and a top layer coil. In someembodiments, the coil sets may include multiple complementary coils fromeach layer (e.g., a two-by-two array of overlapping coils from thebottom, middle, and top layers described above, a four-by-two array,etc.).

If the process determines (at 2460) that there was no response, theprocess may repeat operations 2410-2460 until the process determines (at2460) that a response has been received.

If the process determines (at 2460) that an appropriate response hasbeen received, the process may set the status of the user device to“discovered”.

After setting (at 2470) the status to “discovered”, or after determining(at 2420) that the status was “discovered”, the process may charge (at2480) the device and then may end. An example of such charging will bedescribed in more detail in reference to process 2600 below.

FIG. 25 illustrates a flow chart of an exemplary process 2500 thatperforms a digital ping to identify optimal charging coils. Such aprocess may be executed by a charging resource of some embodiments, suchas resource 120. The process may be performed as operation 2450described above.

As shown, process 2500 may retrieve (at 2510) list of coils associatedwith the analog ping response (such coils may be distributed across thevarious coil layers). Next, the process may retrieve (at 2520) a list ofavailable coil sets, where each coil set may include at least one coilfrom each layer (e.g., bottom, middle, and top layers). The process maythen identify (at 2530) coil sets that overlap the list of coils andgenerate a list of overlapping coil sets.

Next, the process may determine (at 2540) whether all coil sets in thelist of overlapping coil sets has been evaluated. If the processdetermines (at 2540) that not all coil sets have been evaluated, theprocess may retrieve (at 2550) the next coil set from the list ofoverlapping coil sets and activate (at 2560) the next coil set.

Process 2500 may then determine (at 2570) whether a response has beenreceived from the user device. Such a response message may includevarious content elements, quality parameters (e.g., packet error rate),and/or other information. Next, the process may record (at 2580) theresponse.

Next, the process may determine (at 2540) whether all coil sets havebeen evaluated. If the process determines (at 2540) that not all coilsets have been evaluated, the process may repeat operations 2540-2580until the process determines (at 2540) that all coil sets have beenevaluated.

If the process determines (at 2540) that all coil sets have beenevaluated, the process may exit the digital ping, select (at 2590) theoptimal coil set(s) and then may end. Such optimal coil set(s) may beidentified based on comparison of various quality parameters to variousselection criteria (e.g., minimum quality threshold). In someembodiments optimal coil set(s) may be identified by sorting the coilsets by some parameter value and selecting one or more coil sets. Theoptimal coil set(s) may be stored in a list or other appropriate dataelement.

FIG. 26 illustrates a flow chart of an exemplary process 2600 thatadjusts device charging parameters based on user device feedback. Such aprocess may be executed by a charging resource of some embodiments, suchas resource 120. The process may be performed as operation 2480described above.

As shown, process 2600 may retrieve (at 2610) a list of optimal coilsets. The list may be generated using a process such as process 2500.Next, process 2600 may activate (at 2620) the coil sets from the list ofoptimal coil sets.

The process may then monitor the device being charged for responsemessages. Such messages may be sent via a wireless interface (e.g.,Bluetooth, Wi-Fi, etc.) and/or through the coils themselves. Themessages may include control error (CE) packet messages. The chargingresource may also determine a packet error rate when decoding the CEpackets. Next, the process may determine (at 2630) whether there hasbeen a response failure. Such a response failure may include, forinstance, lack of a response message, receipt of a message withinappropriate content or heading, receipt of a warning or error message(e.g., charging power too high), etc. If the process determines (at2630) that there has not been a response failure, the process may adjust(at 2640) the charging power (and/or other charging parameters).

The power adjustment may be based on the CE packet and the calculatedpacket error rate. Various hardware parameters may be adjusted,including voltage, frequency, duty cycle, and phase shift, where thelisted order may be the preferred level of priority. Various mobiledevices may have different packet error rates. As such, the chargingresource may adapt to different user device models. Some embodiments maybegin with a low charging power and gradually increase the power toadapt to the requirements of each individual device. In this way, asingle charging resource is able to serve various devices that may havedifferent charging power limitations.

If the process determines (at 2630) that there has been a responsefailure, the process may then determine (at 2650) whether a timeoutthreshold has been exceeded. If the process determines (at 2650) thatthe threshold has not been exceeded, the process may repeat operations2630-2650 until the process determines (at 2640) that the threshold hasbeen exceeded. Such operations may be repeated at regular intervals thatmay correspond to specified messaging intervals for the device beingcharged.

If the process determines (at 2650) that the timeout threshold has beenexceeded, the process may set (at 2660) the device status to“undiscovered” and then may end.

One of ordinary skill in the art will recognize that processes 2300-2600are presented for exemplary purposes and may be implemented in variousdifferent ways without departing from the scope of the disclosure. Forinstance, the various operations may be performed in different orders.As another example, some operations may be omitted and/or otheroperations may be included. Each process may be divided into multiplesub-processes and/or included in a macro process. In addition, theprocesses (or portions thereof) may be performed iteratively and/orbased on some performance criteria.

IV. Computer System

Many of the processes and modules described above may be implemented assoftware processes that are specified as one or more sets ofinstructions recorded on a non-transitory storage medium. When theseinstructions are executed by one or more computational element(s) (e.g.,microprocessors, microcontrollers, digital signal processors (DSPs),application-specific integrated circuits (ASICs), field programmablegate arrays (FPGAs), etc.) the instructions cause the computationalelement(s) to perform actions specified in the instructions.

In some embodiments, various processes and modules described above maybe implemented completely using electronic circuitry that may includevarious sets of devices or elements (e.g., sensors, logic gates, analogto digital converters, digital to analog converters, comparators, etc.).Such circuitry may be able to perform functions and/or features that maybe associated with various software elements described throughout.

FIG. 27 illustrates a schematic block diagram of an exemplary computersystem 2700 used to implement some embodiments. For example, the systemdescribed above in reference to FIG. 1 may be at least partiallyimplemented using computer system 2700. As another example, theprocesses described in reference to FIG. 23-FIG. 26 may be at leastpartially implemented using sets of instructions that are executed usingcomputer system 2700.

Computer system 2700 may be implemented using various appropriatedevices. For instance, the computer system may be implemented using oneor more personal computers (PCs), servers, mobile devices (e.g., asmartphone), tablet devices, and/or any other appropriate devices. Thevarious devices may work alone (e.g., the computer system may beimplemented as a single PC) or in conjunction (e.g., some components ofthe computer system may be provided by a mobile device while othercomponents are provided by a tablet device).

As shown, computer system 2700 may include at least one communicationbus 2705, one or more processors 2710, a system memory 2715, a read-onlymemory (ROM) 2720, permanent storage devices 2725, input devices 2730,output devices 2735, audio processors 2740, video processors 2745,various other components 2750, and one or more network interfaces 2755.

Bus 2705 represents all communication pathways among the elements ofcomputer system 2700. Such pathways may include wired, wireless,optical, and/or other appropriate communication pathways. For example,input devices 2730 and/or output devices 2735 may be coupled to thesystem 2700 using a wireless connection protocol or system.

The processor 2710 may, in order to execute the processes of someembodiments, retrieve instructions to execute and/or data to processfrom components such as system memory 2715, ROM 2720, and permanentstorage device 2725. Such instructions and data may be passed over bus2705.

System memory 2715 may be a volatile read-and-write memory, such as arandom access memory (RAM). The system memory may store some of theinstructions and data that the processor uses at runtime. The sets ofinstructions and/or data used to implement some embodiments may bestored in the system memory 2715, the permanent storage device 2725,and/or the read-only memory 2720. ROM 2720 may store static data andinstructions that may be used by processor 2710 and/or other elements ofthe computer system.

Permanent storage device 2725 may be a read-and-write memory device. Thepermanent storage device may be a non-volatile memory unit that storesinstructions and data even when computer system 2700 is off orunpowered. Computer system 2700 may use a removable storage deviceand/or a remote storage device as the permanent storage device.

Input devices 2730 may enable a user to communicate information to thecomputer system and/or manipulate various operations of the system. Theinput devices may include keyboards, cursor control devices, audio inputdevices and/or video input devices. Output devices 2735 may includeprinters, displays, audio devices, etc. Some or all of the input and/oroutput devices may be wirelessly or optically connected to the computersystem 2700.

Audio processor 2740 may process and/or generate audio data and/orinstructions. The audio processor may be able to receive audio data froman input device 2730 such as a microphone. The audio processor 2740 maybe able to provide audio data to output devices 2740 such as a set ofspeakers. The audio data may include digital information and/or analogsignals. The audio processor 2740 may be able to analyze and/orotherwise evaluate audio data (e.g., by determining qualities such assignal to noise ratio, dynamic range, etc.). In addition, the audioprocessor may perform various audio processing functions (e.g.,equalization, compression, etc.).

The video processor 2745 (or graphics processing unit) may processand/or generate video data and/or instructions. The video processor maybe able to receive video data from an input device 2730 such as acamera. The video processor 2745 may be able to provide video data to anoutput device 2740 such as a display. The video data may include digitalinformation and/or analog signals. The video processor 2745 may be ableto analyze and/or otherwise evaluate video data (e.g., by determiningqualities such as resolution, frame rate, etc.). In addition, the videoprocessor may perform various video processing functions (e.g., contrastadjustment or normalization, color adjustment, etc.). Furthermore, thevideo processor may be able to render graphic elements and/or video.

Other components 2750 may perform various other functions includingproviding storage, interfacing with external systems or components, etc.

Finally, as shown in FIG. 27, computer system 2700 may include one ormore network interfaces 2755 that are able to connect to one or morenetworks 2760. For example, computer system 2700 may be coupled to a webserver on the Internet such that a web browser executing on computersystem 2700 may interact with the web server as a user interacts with aninterface that operates in the web browser. Computer system 2700 may beable to access one or more remote storages 2770 and one or more externalcomponents 2775 through the network interface 2755 and network 2760. Thenetwork interface(s) 2755 may include one or more applicationprogramming interfaces (APIs) that may allow the computer system 2700 toaccess remote systems and/or storages and also may allow remote systemsand/or storages to access computer system 2700 (or elements thereof).

As used in this specification and any claims of this application, theterms “computer”, “server”, “processor”, and “memory” all refer toelectronic devices. These terms exclude people or groups of people. Asused in this specification and any claims of this application, the term“non-transitory storage medium” is entirely restricted to tangible,physical objects that store information in a form that is readable byelectronic devices. These terms exclude any wireless or other ephemeralsignals.

It should be recognized by one of ordinary skill in the art that any orall of the components of computer system 2700 may be used in conjunctionwith some embodiments. Moreover, one of ordinary skill in the art willappreciate that many other system configurations may also be used inconjunction with some embodiments or components of some embodiments.

In addition, while the examples shown may illustrate many individualmodules as separate elements, one of ordinary skill in the art wouldrecognize that these modules may be combined into a single functionalblock or element. One of ordinary skill in the art would also recognizethat a single module may be divided into multiple modules.

The foregoing relates to illustrative details of exemplary embodimentsand modifications may be made without departing from the scope of thedisclosure as defined by the following claims.

I claim:
 1. A wireless charging resource comprising: a plurality ofprocessing elements; a plurality of insulating elements; and a pluralityof coils, wherein the processing elements, insulating elements, andcoils are arranged in a repeating array.
 2. The wireless chargingresource of claim 1, wherein the plurality of coils comprises aplurality of sets of coils, each set of coils including a first coil ona first layer, a second coil on a second layer, and a third coil on athird layer.
 3. The wireless charging resource of claim 1, wherein therepeating array comprises a number of discrete interlocking sections,each discrete interlocking section comprising a set of processingelements, a set of insulating elements, and a set of coils.
 4. Thewireless charging resource of claim 1, wherein each coil on a firstlayer of coils overlaps an insulating element on an insulating layer. 5.The wireless charging resource of claim 4, wherein each coil on thefirst layer has a cylindrical shape with a radius, and each insulatingelement has a hexagonal shape with a distance between opposite sides andthe radius is less than the distance.
 6. The wireless charging resourceof claim 1, wherein the wireless charging resource engages a user devicehaving a charging receiver by: sending an analog ping to identify a listof charging coils associated with a charging receiver; retrieving a listof charging coil sets from among the plurality of coils; generating alist of charging coil sets that overlap any coil from the list ofcharging coils associated with the charging receiver; and iteratively,until all coil sets from the list of charging coil sets have beenevaluated: selecting a next charging coil set from the list of chargingcoil sets; activating the next charging coil set; and recording aresponse from a user device associated with a charging receiver.
 7. Thewireless charging resource of claim 1, wherein the wireless chargingresource adjusts charging power by changing at least one of voltage,frequency, duty cycle, and phase shift based on messages received fromthe user device.
 8. A method of performing wireless charging, the methodcomprising: sending, from a charging resource, an analog ping toidentify a list of charging coils associated with a charging receiver;sending, from the charging resource, a digital ping to identify a set ofoptimal charging coils; and activating the set of optimal charging coilsin order to provide charging power to the charging receiver.
 9. Themethod of claim 8, wherein sending the digital ping comprises:retrieving a list of charging coil sets; generating a list of chargingcoil sets that overlap any coil from the list of charging coilsassociated with the charging receiver; and iteratively, until all coilsets from the list of charging coil sets have been evaluated: selectinga next charging coil set from the list of charging coil sets; activatingthe next charging coil set; and recording a response from a user deviceassociated with the charging receiver.
 10. The method of claim 9,wherein sending the digital ping further comprises selecting the set ofoptimal transmitting coils based on the recorded responses.
 11. Themethod of claim 9, wherein the charging coil sets are arranged in arepeating array.
 12. The method of claim 8 further comprising receivinga response from a user device associated with the charging receiver andadjusting charging power based on the response.
 13. The method of claim12, wherein adjusting charging power comprises changing at least one ofvoltage, frequency, duty cycle, and phase shift.
 14. The method of claim8, wherein the set of optimal charging coils comprises a first coilassociated with a first layer, a second coil associated with a secondlayer, and a third coil associated with a third layer.
 15. A method ofgenerating a layout for a wireless charging transmitter, the methodcomprising: determining an available transmitter area; calculating anumber of coils to be included in an array; arranging a first set ofcoils including the number of coils on a first coil layer; arranging asecond set of coils including the number of coils on a second coillayer; arranging a third set of coils including the number of coils on athird coil layer; and arranging an insulating layer to align with thefirst set of coils; and arranging a processing layer to align with theinsulating layer; wherein the first set of coils includes a plurality ofcylindrical coils, the insulating layer comprises a plurality ofhexagonal insulating elements, and the processing layer comprises aplurality of rectangular processing elements.
 16. The method of claim15, wherein: each cylindrical coil has a same radius, each hexagonalinsulating element has a same distance between opposite sides and thesame radius is less than the same distance, and each rectangular elementhas a same side length that is equal to a side length of each hexagonalinsulating element.
 17. The method of claim 16, wherein the first set ofcoils, the second set of coils, the third set of coils, the insulatingelements, and the rectangular processing elements are arranged using anarray of repeating sections.